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The HiPC conference series has a strong relationship with industry, both within India and internationally, including industry involvement in its steering and organizing committees. The conference welcomes (and strongly encourages) industry participation are all levels including in the technical program, the student symposium, and especially in the industry/user symposium and vendor exhibition. Details about these and other events in the past years in the conference are available at the conference website at hipc.org. Various sponsorship opportunities are also available as listed below. Sponsors are also encouraged to participate in defining the user/industry symposium events.
Companies and R&D laboratories are encouraged to present their exhibits at the meeting. The following sponsorship levels are available. |
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| I. Platinum Level, INR 500,000 (US$12000) |
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Participate in the definition of one of the user sessions (best practices) and also actively participate in running the user session with other sponsors (storage, systems management, application development, other). |
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Can invite 10 customers, business partners with complementary registration for the conference |
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10 complementary conference registrations for their own employees |
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Literature distributed with the conference registration kit |
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Large-size logo on conference website and publicity materials** |
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Large booth at the conference exhibition |
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| II. Gold Level, INR 300,000 (US$7000) |
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Participate in the definition of one of the user sessions |
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5 complimentary conference registrations for business partners, customers |
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10 complementary conference registrations |
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Literature distributed with the conference registration kit |
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Logo on conference website and publicity materials** |
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Large booth at the conference exhibition |
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| III. Silver Level, INR 100,000 (US$2500) |
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3 complementary conference registrations |
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Literature distributed with the conference registration ki |
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Logo on conference website and in publicity materials** |
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| ** Logos will be placed on the conference website and on the banner in the conference hall. |
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| Additional sponsor opportunities (Please contact HiPC Industry Co-chairs for details) |
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Student symposium best paper awards |
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Student travel awards |
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Conference banquet and cultural event |
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Poster session and reception |
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Registration kit |
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Further details on industry sessions, exhibits, sponsorship information can be obtained contacting the Industry Liaison co-chairs. |
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Industry Liaison Co-Chairs |
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Rama K. Govindaraju, Google, USA |
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rama.govindaraju AT gmail DOT com |
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R. Badrinath, HP, India |
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ramamurthy.badrinath AT hp DOT com |
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