HiPC 2007 Flyer »    HiPC 2007 Call for Papers            The 14th annual IEEE International Conference on High Performance Computing (HiPC 2007) will be held in Goa, India, during December 18-21, 2007. It will serve as a forum to present the current work by researchers from around the world, and act as a venue to provide stimulating discussions and highlight high performance computing activities in Asia. The conference has a history of attracting participation from reputed researchers from all over the world. HiPC 2007 will focus on the design and analysis of high performance computing and networking systems and their scientific, engineering, and commercial applications. In addition to technical sessions consisting of contributed papers, the conference will include invited presentations, a poster session, tutorials, and vendor presentations. Further information about HiPC 2007 conference and HiPC series of meetings is available at http://www.hipc.org.       HiPC 2007 will focus on all aspects of high performance computing. Topics of interest include but are not limited to:   High-Performance Computing   Parallel and Distributed Algorithms   Parallel Languages and Programming Environments   Load Balancing, Scheduling and Resource Management   Fault-Tolerant Algorithms and Systems   Scientific/Engineering/Commercial Applications and Workloads   Emerging Applications such as Biotechnology and Nanotechnology   Cluster and Grid Computing   Peer-to-peer Algorithms and Networks   Heterogeneous Computing   Wireless and Mobile Computing   Communication/Sensor Networks and Embedded Applications   Interconnection Networks and Architectures   Scalable Servers and Systems   Power-Efficient and Reconfigurable Architectures   Compiler Technologies for High-Performance Computing   Software Support and Advanced Micro-architecture Techniques   Operating Systems for Scalable High-Performance Computing       Authors are invited to submit original unpublished manuscripts that demonstrate current research in all areas of high performance computing including design and analysis of parallel and distributed systems, embedded systems, and their applications in scientific, engineering, and commercial areas.       Best paper awards   Best paper awards, sponsored by Infosys, will be given for outstanding contributed papers in two areas: (a) Algorithms and Applications, and (b) Systems.       Awards Chair   George Westrom Odetics Inc. and FSEA, USA       TOP ^   Manuscript Guidelines   Submitted manuscripts should be structured as technical papers and may not exceed 14 letter size (8.5 X 11) pages including figures, tables and references. Formatting requirements are 12-point font size, single spaced or higher, with margins of at least 1 inch on each of the four sides. Submissions not conforming to these guidelines may be returned without review. Authors should submit the manuscript in PDF format and make sure that the file will print on a printer that uses letter size (8.5 X 11) paper. The official language of the meeting is English. Manuscript submission will start on April 7, 2007. Manuscript submission procedures will then be available over the Web at http://www.hipc.org. Electronic submissions must be in the form of a readable PDF file. Manuscripts must be received by May 15, 2007. All manuscripts will be reviewed and will be judged on correctness, originality, technical strength, significance, quality of presentation, and interest and relevance to the conference attendees. Submitted papers may not have appeared in or be under consideration for another conference or a journal. Submissions received after the due date, exceeding length limit, or not appropriately structured may not be considered. Authors may contact the Program Chair at the address below for further information or clarification. Notification of review decisions will be mailed by July 16, 2007. Camera-ready papers are due by August 20, 2007. The proceedings will be published by Springer-Verlag, Lecture Notes in Computer Science, and will be available at the conference.       Program Chair   Srinivas Aluru Iowa State University, USA         HiPC 2007- PAPER SUBMISSION is CLOSED   Suggestions and resources for writing technical papers   Writing Resources: http://www.cse.unl.edu/~goddard/WritingResources/ Suggestions to write technical papers: http://www.philadelphia.edu.jo/pdf/r1.pdf       Important Dates   April 07, 2007 - Paper Submission Begins May 15, 2007 - Paper Submission Ends May 14, 2007 - Workshop Proposals Due May 21, 2007 - Tutorial Proposals Due July 16, 2007 - Notification of Acceptance/Rejection August 20, 2007 - Camera-Ready Paper Submission October 4, 2007 - Poster Submission Deadline November 7, 2007 - Early Registration Deadline       General Co-Chairs   Manish Parashar, Rutgers University, USA Ramamurthy Badrinath, HP, India       Vice General Co-Chairs   Rajendra V. Boppana, University of Texas at San Antonio, USA Rajeev Muralidhar, Intel, India       Steering Committee   P. Anandan, Microsoft Research, India David A. Bader, Georgia Institute of Technology, USA Ramamurthy Badrinath, HP, India Rudramuni B., Dell India R&D, Bangalore, India Frank Baetke, HP, USA R. Govindarajan, Indian Institute of Science, India Harish Grama, IBM, India Manish Gupta, India Systems and Technology Lab, IBM, India Vittal Kini, Intel, India N. S. Nagaraj, Infosys, India Viktor K. Prasanna, University of Southern California, USA (Chair) Venkat Ramana, Cray-Hinditron, India Sartaj Sahni, University of Florida, USA V. Sridhar, Satyam Computer Services Ltd., India Harrick M. Vin, Tata Research, Development and Design Center (TRDDC), Pune, India       TOP ^   Program Chair   Srinivas Aluru, Iowa State University, USA       Program Vice-Chairs   Algorithms - Peter Sanders, Universität Karlsruhe, Germany Applications - Sivan Toledo, Tel-Aviv University, Israel Architecture - Peter J. Varman, Rice University, USA Communication Networks - Dhabaleswar K. (DK) Panda, Ohio State University, USA Mobile and Sensor Computing - Ahmed Helmy, University of Florida, USA Systems Software - Manish Gupta, IBM Corporation, India       Program Committee   Algorithms   Thomas Cormen, Dartmouth College, USA Devdatt Dubhashi, Chalmers Univ. of Tech. and Göteborg Univ., Sweden Matteo Frigo, University of Paderborn, Germany Klaus Jansen, University of Kiel, Germany Christos Kaklamanis, University of Patras, Greece Samir Khuller, University of Maryland, USA Dariuzs Kowalski, University of Liverpool, Great Britain Jesper Larsson Traeff, C&C Research Labs, NEC Europe Ltd., Germany Ulrich Meyer, Max-Planck-Institut für Informatik Saarbrücken, Germany Geppino Pucci, University of Padova, Italy Harald Raecke, Toyota Technological Institute, USA Ulrich Rüde, University of Erlangen Nuremberg, Germany Sandeep Sen, IIT Delhi, India Christian Sohler, University of Paderborn, Germany Philippas Tsigas, Chalmers Univ. of Tech. and Göteborg Univ., Sweden Berthold Vöcking, RWTH Aachen, Germany       Applications   David Abramson, Monash University, Australia Nikos Chrisochoides, College of William & Mary, USA Luc Giraud, INSEEIHT, Toulouse, France Ananth Grama, Purdue University, USA Phalguni Gupta, IIT Kanpur, India Eldad Haber, Emory University, USA Fumihiko Ino, Osaka University, Japan Moshe Israeli, Technion, Israel Mike Kirby, University of Utah, USA Xiaoye (Shery) Li, Lawrence Berkeley National Laboratory, USA  Lois Curfman McInnes, Argonne National Laboratory, USA Kengo Nakajima, University of Tokyo, Japan Christopher S. Oehmen, Pacific Northwest National Laboratory, USA Vivek Sarin, Texas A&M University, USA Olaf Schenk, University of Basel, Switzerland Bertil Schmidt, Nanyang Technological University, Singapore Matthew Smith, University of Marburg, Germany Ravi Sundaram, Northeastern University, USA Jacob White, MIT, USA       Architecture   Stergios Anastasiadis, University of Ioannina, Greece Rajeev Balasubramonian, University of Utah, USA Anasua Bhowmik, AMD, India Kshitij Doshi, Intel, USA Maria Garzaran, University of Illinois Urbana, USA Georgi N. Gaydadjiev, Delft University, Netherlands John Janakiraman, HP Labs, USA Eun-Jung Kim, Texas A&M University, USA Jose Martinez, Cornell University, USA Ranjani Parthasarathi, Anna University, India Ramesh Rajagopalan, Dell, India Parthasarathy Ranganathan, HP Labs, USA Amir Roth, University of Pennsylvania, USA Anand Sivasubramaniam, Penn State University, USA Daniel Sorin, Duke University, USA Steven Swanson, University of California San Diego, USA Jun Wang, University of Central Florida, USA Jun Yang, University of Pittsburgh, USA       TOP ^   Communication Networks   Pavan Balaji, Argonne National Laboratory, USA Mohammad Banikazemi, IBM TJ Watson Research Center, USA Ron Brightwell, Sandia National Laboratory, USA Darius Buntinas, Argonne National Laboratory, USA Wu-Chun Feng, Virginia Tech University, USA Jose Flich, University of Politechnica de Valencia, Spain Ada Gavrilovska, Georgia Tech University, USA Rama K. Govindaraju, Google, USA Darren Kerbyson, Los Alamos National Laboratory, USA Nectarios Koziris, National Technical University of Athens, Greece Olav Lysne, Simula Research Lab, Norway Fabrizio Petrini, Pacific Northwest National Laboratory, USA Tim Pinkston, NSF and University of Southern California, USA Martin Schulz, Lawrence Livermore National Laboratory, USA Yuanyuan Yang, University of Stony Brook, USA       Mobile and Sensor Computing   Kevin Almeroth, UC Santa Barbara, USA Fan Bai, General Motors Research, USA Debojyoti Dutta, University of Southern California, USA Eylem Ekici, Ohio State University, USA Polly Huang, National Taiwan University, Taiwan Vana Kalogeraki, University of California at Riverside, USA Iyad Kanj, DePaul Univ., USA Arunesh Mishra, Univ. of Wisconsin, USA Viktor Prasanna, University of Southern California, USA Tirumale K. Ramesh, Boeing, USA Karim Seada, Nokia Research, USA Raghupathy Sivakumar, Georgia Institute of Technology, USA My Tra Thai, University of Florida, USA Ye Xia, University of Florida, USA Yanchao Zhang, New Jersey Inst. of Tech., USA       Systems Software   Gianfranco Bilardi, University of Padova, Italy Rajkumar Buyya, University of Melbourne, Australia Bronis De Supinski, Lawrence Livermore National Laboratory, USA Beniamino DiMartino, Seconda Universita' di Napoli, Italy R. Govindarajan, IISc Bangalore, India Rinku Gupta, Dell, USA Lawrence Rauchwerger, Texas A&M University, USA Yogish Sabharwal, IBM India Research Laboratory, India P. Sadayppan, Ohio State University, USA Vijay Saraswat, IBM T. J. Watson Research Center, USA Henk Sips, Delft University of Technology, Netherlands Jordi Torres, Univ. Politecnica de Catalunya, Spain Nalini Venkatasubramanian, University of California at Irvine, USA Rajeev Wankar, University of Hyderabad, India Yanyong Zhang, Rutgers University, USA       HiPC User Symposium Co-Chairs   TK Ramesh, The Boeing Company, USA Raghuram Tupuri, Advanced Micro Devices (AMD), India Santosh Sreenivasan, Managing Director, Talentain, India       Cyber Chair   Viraj Bhat, Rutgers University, USA       Finance Co-Chairs   Ajay Gupta, Western Michigan University, USA Thondiyil Venugopalan, India       Registration Co-Chairs   Sally Jelinek, Electronic Design Associates, USA Mamatha Raghavendra, Dell, India       Local Arrangements Chair   Venkatesh V. Kamat, Goa University, India Kalyana Krishna, Talentain, India Raghavendra Buddi, NetApp, India       Publications Chair   Sushil K. Prasad, Georgia State University, USA       Publicity Co-Chairs   Sumir Chandra, Rutgers University, USA Manisha Gajbe, Georgia Institute of Technology, USA Rajeev R. Raje, Indiana University Purdue University, Indianapolis, USA       Workshops   Proposals are solicited for workshops to be held in conjunction with the main conference. Interested individuals should submit a proposal by May 14, 2007 to the Workshops Chair. For additional details and submission guidelines, visit http://www.hipc.org.       Workshops Chair   Manimaran Govindarasu Iowa State University, USA         TOP ^   Poster/Presentation   In addition to the contributed papers session, a plenary poster/presentation session emphasizing novel applications of high performance computing is planned. It will offer brief presentation time for each poster and will be followed by a "walk-up and talk" setting. To be considered, send a 5 page summary of your work to the Poster/Presentation Chair by September 24, 2007. For additional details, contact the Poster/Presentation Chair.       Poster/Presentation Chair   Rajeev Thakur Argonne National Laboratory, USA         Tutorials   Proposals are solicited for tutorials to be held at the meeting. Interested individuals/groups should submit a proposal by May 21, 2007 to the Tutorials Chair. The proposal (5 pages maximum) should include a brief description of the intended audience, a lecture outline, and a vita for each lecturer. For additional details, contact the Tutorials Chair.       Tutorials Chair   Rajeev Sivaram, Google, USA         Industry Exhibition   Companies and R&D laboratories are encouraged to present their exhibits at the meeting. Additionally, a full day of vendor presentations is planned. Further details can be obtained at http://www.hipc.org or by contacting the Industry Liaison co-chairs.       Industry Liaison co-chairs   Rama K. Govindaraju, Google, USA     Raghuram Tupuri, AMD, India         Minisymposium on HPC Technologies, Applications & Experience   The minisymposium will bring together providers and users of HPC to provide a forum for presenting the state-of-the-art in HPC platforms and technologies, for discussing best practices and for exchanging experiences. HPC applications and the experiences of application developers will be of special interest to this mini symposium. The minisymposium will consist of invited as well as contributed talks by leading experts from industry, research laboratories and universities, as well as panels and open discussions. For further details and to submit abstract, please visit http://www.hipc.org.       Minisymposium Co-Chairs   Ramesh K. Tirumale, The Boeing Company, USA     Raghuram Tupuri, AMD, India         Travel Scholarships for Students from India   Engineering Colleges to encourage them to attend the conference. This merit-based scholarship will cover their travel and accommodation expenses. The last date of application is October 31, 2007. For more details, please visit the HiPC website, http://www.hipc.org.       Scholarships Co-Chairs   Anu G. Bourgeois, Georgia State University, USA Madhusudhan Govindaraju, SUNY Binghamton, USA         TOP ^           About HiPC | Steering Committee | Sponsors | Archive | Home | HiPC 2007 | Contact | Sitemap     ©2007 HiPC All rights reserved    Design by vikivix