Travel Support for International Students

A limited number of travel assistance grants are available from the HiPC sponsor, IEEE Technical Committee on Parallel Processing (TCPP). Awards will be based on merit, with priority given to students who would otherwise be unable to attend the conference, and to graduate students presenting their own accepted work.

Notice of awards will be made prior to the conference. The grants will be distributed post-conference in the form of reimbursements against actual travel, registration and accommodations expenses submitted by the student. The amount of the grants will be based in part on student travel requirements, quality of paper/poster, and on TCPP funds availability.

 

Eligibility

To qualify for a student travel assistance grant, an applicant must be:
– an author of an accepted conference or workshop paper and be registered for the conference,
– a Student Member of IEEE Computer Society at the time he/she submits an application, and
– a full-time student regularly registered toward a degree in computer science, engineering or related field at a university.

 

How to Apply

To apply for a grant, complete the information in the form below and use the Submit button at the bottom of the form to send your application to the TCPP travel grant committee. Please follow instructions! The information about your advisor will be used to obtain your advisor’s official endorsement – an email will be sent to your advisor with a request to endorse your travel once you are selected for consideration. Note that without endorsement from your advisor we will not make the award.

The application form can be accessed here.

Applicants are encouraged to make their travel plans without depending on notification from the committee to ensure that lowest cost flights and accommodations have been secured.

Please be advised that in order to be reimbursed, applicants from US-based universities must use US-based carriers for their airfare (as required by the Fly America Act)!

 

Important Dates

Application Deadline: November 4, 2019

• Notification: November 10, 2019

Address any inquiries to this email.

 

 

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