Travel support opportunities are available for all student participants at HiPC 2018 in Bengaluru.
HiPC would like to encourage motivated students studying at engineering and technical colleges in India to attend the conference through these travel scholarships, which will be provided on a merit basis.
A limited number of travel assistance grants for students outside India are available from the HiPC sponsor, IEEE Technical Committee on Parallel Processing (TCPP). Priority will be given to students -based on merit- who would otherwise be unable to attend the conference and to graduate students presenting their own accepted work.
Notice of awards will be made prior to the conference, but all applicants must register to be eligible to apply. The grants will be distributed either at the conference or post-conference in the form of reimbursements against actual travel and accommodations expenses submitted by the student.
Full details including eligibility, covered expenses, compliance policies, and the application form, are available here:
• Application Deadline: November 4, 2018
• Notification: November 10, 2018
Please revisit this page for more information.